Publications

  • "Performance Study of the First 2D Prototype of Vertically Integrated Pattern Recognition Associative Memory (VIPRAM)", arXiv https://arxiv.org/abs/1709.08303, Gregory Deptuch, James Hoff, Sergo Jindariani, Tiehui Liu, Jamieson Olsen, Nhan Tran, Siddhartha Joshi, Dawei Li, Seda Ogrenci-Memik
  • "A Content Addressable Memory with Multi-Vdd Scheme for Low Power Tunable Operation", S Joshi, D. Li, S Ogrenci-Memik, J Hoff, S Jindariani, T Liu, J Olsen, G. Deptuch, N Tran, 60th International IEEE MWSCAS, 2017
  • "End-to-End Analysis of Integration for Thermocouple-Based Sensors Into 3-D ICs", D Li, S Joshi, JH Kim, S Ogrenci-Memik, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2017
  • “VIPRAM_L1CMS: A 2-Tier 3D Architecture for Pattern Recognition for Track Finding", J. Hoff, S. Joshi, T. Liu, J. Olsen, and A. Shenai, 2017.
  • "Thin Film Thermocouple Fabrication Procedure", by S Joshi, G Sundar, F Rao, S Ogrenci-Memik, M Grayson, Technical Report published by Northwestern University, 2017
  • "A methodology for power characterization of associative memories", D Li, S Joshi, S Ogrenci-Memik, J Hoff, S Jindariani, T Liu, J Olsen, N Tran, 33rd IEEE International Conference on Computer Design (ICCD), 2015
  • "Design and testing of the first 2D prototype vertically integrated pattern recognition associative memory", T Liu, G Deptuch, J Hoff, S Jindariani, S Joshi, J Olsen, N Tran, M Trimpl, Journal of Instrumentation, 2015
  • "Vertically integrated pattern recognition associative memory for track finding", J Hoff, G Deptuch, S Jindariani, S Joshi, T Liu, J Olsen, M Trimpl, at TWEPP, UK
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