• "Performance Study of the First 2D Prototype of Vertically Integrated Pattern Recognition Associative Memory (VIPRAM)", arXiv, Gregory Deptuch, James Hoff, Sergo Jindariani, Tiehui Liu, Jamieson Olsen, Nhan Tran, Siddhartha Joshi, Dawei Li, Seda Ogrenci-Memik
  • "A Content Addressable Memory with Multi-Vdd Scheme for Low Power Tunable Operation", S Joshi, D. Li, S Ogrenci-Memik, J Hoff, S Jindariani, T Liu, J Olsen, G. Deptuch, N Tran, 60th International IEEE MWSCAS, 2017
  • "End-to-End Analysis of Integration for Thermocouple-Based Sensors Into 3-D ICs", D Li, S Joshi, JH Kim, S Ogrenci-Memik, IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2017
  • “VIPRAM_L1CMS: A 2-Tier 3D Architecture for Pattern Recognition for Track Finding", J. Hoff, S. Joshi, T. Liu, J. Olsen, and A. Shenai, 2017.
  • "Thin Film Thermocouple Fabrication Procedure", by S Joshi, G Sundar, F Rao, S Ogrenci-Memik, M Grayson, Technical Report published by Northwestern University, 2017
  • "A methodology for power characterization of associative memories", D Li, S Joshi, S Ogrenci-Memik, J Hoff, S Jindariani, T Liu, J Olsen, N Tran, 33rd IEEE International Conference on Computer Design (ICCD), 2015
  • "Design and testing of the first 2D prototype vertically integrated pattern recognition associative memory", T Liu, G Deptuch, J Hoff, S Jindariani, S Joshi, J Olsen, N Tran, M Trimpl, Journal of Instrumentation, 2015
  • "Vertically integrated pattern recognition associative memory for track finding", J Hoff, G Deptuch, S Jindariani, S Joshi, T Liu, J Olsen, M Trimpl, at TWEPP, UK